1～15 item / All 18 items
This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern.
By holding three points on the outer circumference of the silicon wafer and rotating the θ table, the thickness at any location can be measured. Our unique "non-contact earth" method allows for safe, non-contact handling.
This is a device for measuring the thickness of SiC wafers adhered to a glass plate and the thickness of the adhesive, as well as measuring the thickness of individual SiC wafers.
- The thickness is measured non-contact using an optical probe/sensor. - A porous chuck-type wafer stage is used to uniformly hold thin wafers. - Measurement data is saved in CSV format, in addition to being displayed on the monitor of the accompanying computer. Graphical display is also possible.
This is a device that removes silicon wafers from a dedicated cassette and measures the thickness at the set points.
- The wafer thickness is measured non-contact using a capacitance sensor. - Wafer size changes are possible through recipe settings, eliminating the need for setup changes. - The measurement point is set to one point at the center, with cross measurements configured in the recipe. The number of points and their positions during cross measurements can also be specified. - The measured data is saved on the accompanying computer.
Thickness measurement of various types of wafers below φ4"
This machine is a device that manually measures the thickness of various materials' wafers with a diameter of 4 inches or less. The thickness measurement is performed using a confocal chromatic aberration sensor, measuring the difference between a block gauge or reference wafer and the target wafer in a one-sided measurement.
This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and double-sided polishing process.
Set the carrier, move to the pre-set measurement position by operating the [Start] switch, and perform the measurement by operating the [Measure] switch. The θ-axis direction depends on the operator's setting. The measurement values will be displayed on the counter. It is also possible to record the data on a computer as an option.
This is a device that detects the wafer edge using laser light and measures the diameter by comparing it with a calibration wafer (reference wafer).
- The diameter of the wafer is measured non-contact. - By rotating the stage, the A diameter (3 points) and B diameter can be measured. - The LOT NO. and other information can be read using a barcode reader. - The measurement values are saved in Excel format on the accompanying computer.
Classified by resistivity and thickness categories.
This is a device that measures the thickness and resistance of silicon wafers and classifies them into specified resistivity categories or categories based on resistivity and thickness.
This machine is a device for measuring the thickness of φ8” silicon wafers.
It is a device that performs non-contact, automatic measurements of the thickness of Si wafers and various measurements of Si step parts.
This is a device that detects the wafer edge using green LED light and measures the diameter by comparing it with a calibration wafer (reference wafer).
The diameter measurement values (average diameter values, etc.) will be saved in Excel format on the attached computer.
The very popular TME series
□TME-02A Type/TME-02B Type□ This is a device that extracts silicon wafers from a dedicated cassette using edge handling and measures the thickness of a set pattern. It holds three points on the outer circumference of the silicon wafer and rotates the θ table to measure the thickness at any desired location. Thanks to our unique "non-contact earth" method, it allows for safe and non-contact handling. It is equipped with a barcode reader, and the scanned barcode number can be saved in a specified cell in Excel. □TME-03 Type□ This is a device that extracts silicon wafers from a dedicated cassette and measures the thickness of a set pattern. The chucking of the silicon wafer during transport and measurement at the stage uses vacuum to hold the backside.
Thickness measurement device for silicon wafers with a diameter of φ200mm and φ300mm.
This machine is a device for measuring the thickness of silicon wafers with diameters of φ200mm and φ300mm. The setting and measurement of the wafers are performed by manual operation by the operator.
Thickness measurement of Si, SiC, and other wafers with a diameter of φ100mm to φ150mm.
This machine is a device for manually measuring the thickness of wafers such as Si and SiC with diameters ranging from φ100mm to φ150mm. The thickness measurement is performed using a high-precision contact digital sensor and is conducted on one side.
Thickness measurement of compound semiconductor wafers in sizes φ2”, φ4” or φ6”.
This machine is a device for manually measuring the thickness of compound semiconductor wafers in sizes of φ2”, φ4”, or φ6”. Thickness measurements are performed using an optical sensor, with standalone wafers measured by clamping and wafers attached to a flat plate measured from one side. To conduct each type of measurement, two types of measurement stages are prepared, and the sensors are swapped out for the measurements.
This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.
Set the carrier, and it will automatically measure the pre-set measurement position by operating the [Start] switch. The measurement data will be recorded on the included computer.
This is a device used to measure the thickness of metal or resin carriers used in the silicon wafer lapping process and the double-sided polishing process.
The operator can determine the measurement position and measure the thickness using a foot switch. The measurement values are displayed on the counter. It is also possible to record them on a computer as an option.
